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Henan E-Grind Abrasives Co., Ltd.

Products >> Dicing Blades Without Hub

Dicing Blades Without Hub

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Description
Product Name: Dicing Blades Without Hub
Supply Ability:
Related proudcts wafer saw blade,
Specifications Dicing Blades Without Hub
Price Term:
Port of loading:
Minimum Order 1
Unit Price: USD10-USD2,000/pc

The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.

Contact Us
Company: Henan E-Grind Abrasives Co., Ltd.
Contact: Mr. egrind wheel
Address: Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China
Postcode: 450000
Tel: 0371-68616868
Fax: 0371-68616868
E-mail:         


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Tel : 0371-68616868 Fax : 0371-68616868
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